Nano Micro Biz (Dates: April 23 (Wed.) - 25 (Fri.), 2014)

Nano Micro Biz

April 23 - 25, 2014
Pacifico Yokohama
ORGANIZED BY:Micromachine Center

MAIN CONTENTS

Mitsubishi Heavy Industries will exhibit various panels showing the principles of room temperature bonding and the features of the Room Temperature Wafer Bonder.
A variety of wafer samples are also exhibited in our booth.
During this exhibition our research center engineers will attend the booth and explain our technology so that our customer would be able to use our technology for their research purpose or device manufacturing purposes.
Nano Micro Biz
The world's largest fair focusing on Micro/MEMS, Nano technologies & ROBOT technologies

DATE & TIME April 23 (Wednesday) - 25 (Friday), 2014
10:00 a.m. - 5:00 p.m.
VENUE Pacifico Yokohama
Booth No. S-5
Access (Link to Pacifico Yokohama Website)
ORGANIZED BY Micromachine Center
ADMISSION FEE JPY 2,000 (Free of charge with invitation card or pre-registration)
Please contact us for request invitation card.
Mitsubishi Heavy Industries, Ltd.
Sales Department Machine Tool Division
Phone: +81-77-511-3474
OFFICIAL WEBSITE
OF THE EXHIBITION		 http://www.micromachine.jp/en/

EXHIBITOR

  • Mitsubishi Heavy Industries, Ltd.

EXHIBIT PRODUCTS

  • Mitsubishi Room-Temperature Wafer Bonder "BOND MEISTER"
  • Panel and bonded wafer samples will be exhibited