SEMICON Japan 2014 (Dates: December 3 (Wed.) - December 5 (Fri.), 2014)

SEMICON Japan 2014

December 3 - 5, 2014
Mitsubishi Heavy Industries, Ltd.
Tokyo Big Sight

MAIN CONTENTS

Room Temperature Bonding has following features.

  1. Perfect ambient temperature process.
  2. Strong bonding and high hermetic capability.
  3. Various materials can be bonded.

Mitsubishi Heavy Industries will demonstrate actual bonded wafers from 100mm to 300mm, Silicon, Compound semiconductor, Oxides, Metals.

DATE & TIME December 3 (Wednesday) - December 5 (Friday), 2014
VENUE Tokyo Japan Tokyo Big Sight
ORGANIZED BY http://www.semiconjapan.org/en/
OFFICIAL WEBSITE
OF THE EXHIBITION		 http://www.semiconwest.org/
Business contact Machine Tool Division Sales Department
Phone: +81-77-551-3474

EXHIBITOR

  • Mitsubishi Heavy Industries, Ltd.
    (Booth No.: 3264)