Direct to Chip Cooling solution

[ INFRASTRUCTURE ]

MHI’s liquid cooling system in an innovative technology that enables sustainable data center operations by significantly reducing power and water consumption. It also reduces OPEX and CAPEX by providing higher server density and lower power usage effectiveness (PUE).

Distributors :

Two phase closed loop system expels the heat by evaporating the refrigerant in the cold plate.
Waterless cold plate design eliminates corrosion and other water-related threats to the server.
Direct-to-chip cooling is the most effective method to extract and disperse heat form server chips.
Supporting 70kW GPU/CPU cooling per rack, and deployable in new or retrofitted data centers.

Two-Phase Direct Chip Cooling Product Image

Cold Plate

Direct contact cooling capable of cooling 1500W processors and above.
Self regulated designed to autonomously adjust flow rate of thermal refrigerant to the cold plate.
Certified by major processor manufacturers Nvidia, Intel, and AMD.
Ability to handle 1,000W TDP cooling.
Eliminates hot spots in the data center.
Customized solution to meet the requirements of new and retrofit applications.
Delivers 10x more compute, TCO reduction, and reduced CO2 emissions for a more sustainable data center.
Safe and environmentally friendly noncorrosive dielectric liquid refrigerant.
- Ozone Depletion Potential (ODP): 0
- Global Warming Potential (GWP): 2
- Noncombustible

Heat Rejection Unit

Scalable air and water 6U units capable of handling a maximum of 100kW/unit.
Fully autonomous units have multiple sensors on fans, pumps, controllers, and multi-level leak detection and prevention.
Software driven system that optimizes performance while safeguarding the system against fan and pump failures.
Compact and simple configuration for easy installation with zero disruption.
Capable of installing on existing servers, with minimal server modifications and rack work.
Proven track record of installation in servers of major manufactures (Dell, HP, and Supermicro).
Designed with heat re-use in mind, producing the lowest PUE and highest efficiency in any climate.

Deployment and installation:

Compact and simple configuration for easy installation with zero disruption.
Capable of installing on existing servers, with minimal server modifications and rack work.
Proven track record of installation in servers of major manufactures (Dell, HP, and Supermicro).
Designed with heat re-use in mind, producing the lowest PUE and highest efficiency in any climate.

Product summary

6U HRU Water Specifications
Operating temperature	5°C - 45°C (41°F - 113°F)	Type	Dielectric Refrigerant
Max working pressure	3 bar (refrigerant), 4.5 bar (cooling water)	Temperature working range	2°C - 65°C (36°F - 149°F)
Humidity	20% - 70%	Buffer tank capacity	9L
Waterproof rating	NEMA Type 1	Refrigerant characteristics	Non-conductive, non-corrosive, non- flammable, non-toxic
Power connector shape	C14		Non-conductive, non-corrosive, non- flammable, non-toxic
Other	Thermal insulation and vibration dampening (optional)		Zero ozone depletion potential, low global warming potential
Dimensions	Width: 400 mm Length: 1,100 mm Height: 266 mm	Weight	90kg

Fully contained build, including electrical components and control system
System seal types: FKM (Viton), or compression fittings, or Loctite 577
All wetted material are dielectric refrigerant compatible
Cooling for processors ~70kW

6U HRU Air Specifications
Operating temperature	5°C - 35°C (41°F - 95°F)	Type	Dielectric Refrigerant
Max working pressure	3.2bar	Temperature working range	2°C - 65°C (36°F - 149°F)
Humidity	20% - 70%	Buffer tank capacity	6L
Waterproof rating	NEMA Type 1	Refrigerant characteristics	Non-conductive, non-corrosive, non-flammable, non-toxic
Power connector shape	C14		Non-conductive, non-corrosive, non-flammable, non-toxic
Other	Thermal insulation and vibration dampening (optional)		Zero ozone depletion potential, low global warming potential
Dimensions	Width: 482 mm Length: 1,048 mm Height: 268 mm	Weight	55kg